
Original: $84.50
-65%$84.50
$29.57The Story
Key Features:
- 8GB Memory
- 3200MHz
- DDR4
- CL16
HyperX HX432C16FB3/8 is a 1G x 64-bit (8GB) DDR4-3200 CL16 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 1G x 8-bit FBGA components per module.  Each module kit supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0.  Each module has been tested to run at DDR4-3200 at a low latency timing of 16-18-18 at 1.35V.  The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers.Â
Specifications
- Power Supply: VDD = 1.2V Typical
- VDDQ = 1.2V Typical
- VPP = 2.5V Typical
- VDDSPD = 2.2V to 3.6V
- On-Die termination (ODT)
- 16 internal banks; 4 groups of 4 banks each
- Bi-Directional Differential Data Strobe
- 8 bit pre-fetch
- Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
- Height 1.3425” (34.1mm), w/heatsink

Details & Craftsmanship
Every detail has been carefully considered to bring you the perfect product.
Description
Key Features:
- 8GB Memory
- 3200MHz
- DDR4
- CL16
HyperX HX432C16FB3/8 is a 1G x 64-bit (8GB) DDR4-3200 CL16 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 1G x 8-bit FBGA components per module.  Each module kit supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0.  Each module has been tested to run at DDR4-3200 at a low latency timing of 16-18-18 at 1.35V.  The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers.Â
Specifications
- Power Supply: VDD = 1.2V Typical
- VDDQ = 1.2V Typical
- VPP = 2.5V Typical
- VDDSPD = 2.2V to 3.6V
- On-Die termination (ODT)
- 16 internal banks; 4 groups of 4 banks each
- Bi-Directional Differential Data Strobe
- 8 bit pre-fetch
- Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
- Height 1.3425” (34.1mm), w/heatsink























